When used in epoxy formulations, N‑PMI enhances chemical resistance and reduces warpage under thermal cycling, crucial for printed circuit board encapsulation and high‑power electronics housings. Its inherent flame‑retardancy also helps systems achieve UL‑94 V‑0 compliance without halogenated additives.
Mechanisms of Heat‑Resistance Enhancement
1. Rigid Segments & Cross‑Linking: The maleimide ring creates localized rigidity and potential crosslinks that impede chain mobility, directly lifting glass transition and Vicat points.
2. Thermal Decomposition Delay: Steric hindrance from the phenyl substituent raises the onset of thermal degradation by 20–30 °C, as shown in TGA curves where N‑PMI copolymers retain >90 % mass at 300 °C .
3. Flame Retardancy: The cyclic imide structure promotes char formation and limits dripping, underpinning UL‑94 V‑0 ratings in PVC and epoxy systems .
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